Know before your role does.
pssst. this is to sign up for updates on the game ;)
Will AI replace MEMS Systems Packaging Engineer jobs? · Latest report #cbdbcuxd
Your job has an expiration date
May 20, 2029
In 2 years, 7 monthsMicro-scale hardware design is just Tetris for people with expensive degrees.
Master of micro-scale boxes and thermal stress anxiety.
Check another roleComment your opinionor JOIN THE RESISTANCE!
One human is building a game about fighting back.
Perfect packaging, zero thermal drift.









toast.youAI▸ DIESYNC-X9▸ RARITY · UNCOMMON▸ DEPRECATION IN 2 YEARS, 7 MONTHSAI's Special Power
calibrates drift in nanosecond intervals
You design tiny sensor housings and wire-bond delicate silicon dies. Then you pray the epoxy doesn't leak.
The one thing AI can't do
You can sense when a sensor package will warp just by holding it.
Your enemy, your name, your date. Post it.
Step by step, from the first quiet change to Deprecation Day.
Week 4
AI models generate optimal packaging designs from base CAD specs.
Month 5
Vision-guided saws replace manual dicing oversight in cleanrooms.
Month 13
Real-time sensor feedback adjusts bond tension for every die.
Year 1.9
Digital twins predict failure rates without needing thermal chambers.
Year 2.6 · D-Day
The factory floor runs autonomously; your badge is deactivated.
What you cost, what the machine costs, and what you get on the way out.
Per year
Savings: 94.1%
4 Liters
Coffee consumed per tape-out
12 Percent
Thermal cycle failures per year
Sub-micron
Wire bond accuracy
Your severance
A lifetime supply of high-grade conductive epoxy.
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