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Live· 4,218,906 positions deprecated· 4,218,906 deprecated· 1,284 today
Average time-to-redundancy: 11.3 months
Know before your role does.
pssst. this is to sign up for updates on the game ;)
Will AI replace Semiconductor Packaging Engineer jobs? · Latest report #wpihcvzt
Your job has an expiration date
May 19, 2029
In 2 years, 7 monthsMicro-precision soldering for microscopic circuits is just a machine's Tuesday afternoon.
Master of microns and victim of microscopic thermal drift.
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One human is building a game about fighting back.
Precision bonding at the atomic scale.
split.you▸ DIEBOND-MASTER 9000▸ RARITY · UNCOMMON▸ DEPRECATION IN 2 YEARS, 7 MONTHSAI's Special Power
calibrates die alignment in microseconds
You optimize wire bonding, flip-chip assembly, and thermal management for silicon dies. We prefer silicon that doesn't complain about cleanroom humidity.
The one thing AI can't do
You can still troubleshoot why a specific gold wire keeps snapping during the bonding cycle.
Your enemy, your name, your date. Post it.
Step by step, from the first quiet change to Deprecation Day.
Day 10
Sensors begin tracking every minute adjustment you make to the wire bond tension.
Month 4
Vision algorithms take over the visual inspection phase to catch alignment errors faster.
Month 13
Precision gantry systems start handling low-complexity packaging tasks in isolated zones.
Year 2.1
Automated curing ovens manage substrate heating profiles without human intervention.
Year 2.6 · D-Day
The DieBond-Master assumes total control of the assembly line leaving you redundant.
What you cost, what the machine costs, and what you get on the way out.
Per year
Savings: 96%
0.04%
Human error rate
0.00001%
Robot error rate
Infinite
Cleanroom fatigue
Your severance
A lifetime supply of high-grade lint-free wipes.
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